Supermicro Mainboard X11SPM-F single Socket P LGA 3647
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 165W, Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only), Intel® C621 Chipset, Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8), 2 GbE LAN ports, 12 SATA3 (6Gbps) via C621, Supports 12V DC power input, I/O: 1 VGA, 2 COM, TPM header, 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers), M.2 NGFF connector, M.2 Interface: PCI-E 3.0 x4, Form Factor: 2242, 2280, Key: M-Key, Double Height Connector, 24 Monate Herstellergewährleistung.
