Supermicro Mainboard X11SPH-nCTF single Socket P LGA 3647
2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W
Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Intel® C622 chipset
Expansion slots:
1 PCI-E 3.0 x16 (x16 || x8),
1 PCI-E 3.0 x8 (x0 || x8),
1 PCI-E 3.0 x8,
1 PCI-E 3.0 x4 (in x8)
2 10GbE LAN ports
10 SATA3 (6Gbps) via C622
8 SAS3 (12Gbps) via Broadcom® 3008 RAID 0, 1, 10
2x Port NVMe PCI-E 3.0 x4 via OCuLink
5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4 and SATA
Form Factor: 2280 24 Monate Herstellergewährleistung.
