Mainboards für Server und Workstations

Workstation Mainboard für Single Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3, E5-1600 v3, and 4th gen. Core i7, Intel® C612 chipset, Up to 512GB ECC DDR4 2133MHz LRDIMM or 64GB ECC/non-ECC UDIMM (available with Core i7 only) 8x DIMM slots, 4 PCI-E 3.0 x16 (run at 16/16/NA/8 or 16/8/8/8), 2 PCI-E 2.0 x1 (in x4), Intel® i210-AT Dual port GbE LAN Shared with IPMI, 10x SATA3 (6Gbps), 1x VGA (Aspeed AST 2400 BMC for IPMI), 1x COM, 1x TPM, 8x USB 3.0 ports (6 rear + 2 via header), HD Audio 7.1 channel connector by Realtek ALC1150, 24 Monate limitierte Herstellergewährleistung

Supermicro Mainboard, Dual socket R3 (LGA 2011) unterstützt Intel® Xeon® Prozessoren der E5-2600 v3 Familie QPI bis zu 9.6GT/s, Intel® C612 Chipsatz bis zu 1TB reg. ECC DDR4 2133MHz 16x DIMM Sockel, 3 PCI-E 3.0 x16 und 3 PCI-E 3.0 x8, Intel® i350 Dual port GbE LAN, 10x SATA3 (6Gbps) RAID 0, 1, 5, 10, integriertes IPMI 2.0 und KVM mit dediziertem LAN, 5x USB 3.0 (2 rear, 2 via header, 1 Type A), 6x USB 2.0 (2 rear, 4 via header). 24 Monate limitierte Herstellergewährleistung

Supermicro Mainboard, Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, Intel® C621, Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz, in 16 DIMM slots, 3 PCI-E 3.0 x16 (in x16 slot), 3 PCI-E 3.0 x8, 1 VGA D-Sub Connector port, Intel® C621 controller for 8 SATA3 (6 Gbps) ports RAID 0,1,5,10, Broadcom 3008 SW RAID 8 ports SAS3 0,1,10, Dual LAN with GbE from C621, 24 Monate limitierte Herstellergewährleistung.

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors. Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s, Intel® C621, Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots Up to 2TB Intel® Optane? DC Persistent Memory in memory mode (Cascade Lake only). 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key, 2 PCI-E 3.0 NVMe x4 Internal Port(s), 1 VGA port, Intel® C621 controller for 10 SATA3 (6 Gbps) ports RAID 0,1,5,10
Dual LAN with GbE from C621 24 Monate limitierte Herstellergewährleistung.

Supermicro Mainboard, Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported, Intel® C621, Up to 1TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots, 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8, M.2 Interface: PCI-E 3.0 x4 and PCI-E 3.0 x4, M.2 Form Factor: 22110, M.2 Key: M-Key (RAID 0,1 support), 1 VGA port, Intel® C622 controller for 10 SATA3 (6 Gbps) ports RAID 0,1,5,10, Dual LAN with 1GbE with Marvell® 88E1512, 24 Monate limitierte Herstellergewährleistung.

Supermicro Mainboard, Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, .Intel® C624, Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots, 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8, M2 Interface: PCIe 3.0 x4 and PCIe 3.0 x4, M.2 Form Factor: 22110, M.2 Key: M-Key (RAID 0,1 support), 5.1 VGA port(s), Intel® C624 controller for 10 SATA3 (6 Gbps) ports RAID 0,1,5,10, Dual LAN with 10GBase-T with Intel® X557, 24 Monate limitierte Herstellergewährleistung.

Supermicro Mainboard, Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported, Intel® C622, Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots, 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110, 2 PCI-E 3.0 NVMExpress x4 Internal Port(s), 1 VGA port, Intel® C622 controller for 14 SATA3 (6 Gbps) ports RAID 0,1,5,10, Dual LAN with 10GBase-T with Intel® X722 + X557, 24 Monate limitierte Herstellergewährleistung.